Technomelt Supra Cool 300 | Low-Temperature Hot Melt Adhesive for Packaging
Technomelt Supra Cool 300 is a high-performance polyolefin hot melt adhesive designed for lower application temperatures (130–145°C).
Technomelt Supra Cool 300 is a high-quality synthetic hot melt adhesive engineered for packaging applications that benefit from reduced application temperatures. Applied at just 130–145°C, it offers outstanding bonding performance while delivering measurable energy savings and improved operator safety compared with conventional hot melts.
This versatile adhesive is suitable for bonding cartons, trays and folding boxes, including temperature-sensitive food packaging such as confectionery and deep-freeze products. It combines excellent bond strength with precise, clean application and high thermal stability.
